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Pressure
Freescale Semiconductor Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPX5999D piezoresistive transducer is a state-of-the-art pressure sensor designed for a wide range of applications, but particularly for those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure.
MPX5999D Rev 6, 09/2009
MPX5999D
0 to 1000 kPa (0 to 150 psi) 0.2 to 4.7 V Output
Features
* * * * Temperature Compensated Over 0 to 85C Ideally Suited for Microprocessor or Microcontroller-Based Systems Patented Silicon Shear Stress Strain Gauge Durable Epoxy Unibody Element
ORDERING INFORMATION
Device Name Unibody Package MPX5999D 867 * * MPX5999D Case No. None # of Ports Single Dual Gauge Pressure Type Differential Absolute Device Marking
UNIBODY PACKAGE
MPX5999D CASE 867
(c) Freescale Semiconductor, Inc., 2005-2009. All rights reserved.
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.)
Characteristic Pressure Range(1) Supply Voltage(2) Symbol POP VS IO (0 to 85C) (0 to 85C) (0 to 85C) Voff VFSO VFSS V/P (0 to 85C) -- tR IO+ -- Min 0 4.75 -- 0.088 4.587 -- -- -- -- -- -- Typ -- 5.0 7.0 0.2 4.7 4.5 4.5 -- 1.0 0.1 20 Max 1000 5.25 10 0.313 4.813 -- -- 2.5 -- -- -- Unit kPa Vdc mAdc Vdc Vdc Vdc mV/kPa %VFSS ms mAdc ms
Supply Current Zero Pressure Offset(3)
Full Scale Output(4) Full Scale Sensitivity Accuracy(6) Response Time(7) Output Source Current at Full Scale Output Warm-Up Time(8) Span(5)
1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized.
MPX5999D 2 Sensors Freescale Semiconductor
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating Maximum Pressure
(2)
Symbol P1max Tstg TA
Value 4000 -40 to +125 -40 to +125
Unit kPa C C
(P2 1 Atmosphere)
Storage Temperature Operating Temperature
1. Extended exposure at the specified limits may cause permanent damage or degradation to the device. 2. This sensor is designed for applications where P1 is always greater than, or equal to P2. P2 maximum is 500 kPa.
Figure 1 shows a block diagram of the internal circuitry integrated on the stand-alone sensing chip.
VS 3
Sensing Element
Thin Film Temperature Compensation and Gain Stage #1 2 GND
Gain Stage #2 and Ground Reference Shift Circuitry
1
Vout
Pins 4, 5, and 6 are NO CONNECTS
Figure 1. Fully Integrated Pressure Sensor Schematic
MPX5999D Sensors Freescale Semiconductor 3
Pressure
On-chip Temperature Compensation and Calibration
Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 3 illustrates the differential or gauge configuration in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from harsh
5.0
environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX5999D pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended.
Transfer Function: 4.5 V = V *(0.000901*P+0.04) Error out S 4.0 VS = 5.0 Vdc Temperature = 0 to 85C 3.5 Output (V) 3.0 2.5 2.0 1.5 1.0 0.5 0 0 100 200 300 400 500 600 700 800 Differential Pressure (kPa) MAX MIN
TYP
900 1000 1100
Figure 2. Output vs. Pressure Differential
Stainless Steel Metal Cover P1
Silicone Die Coat Wire Bond
Die
Lead Frame Thermoplastic Case
P2
RTV Die Bond
Figure 3. Cross-Sectional Diagrams (not to scale)
+5 V
Vout Vs IPS 1.0 F 0.01 F GND
Output
470 pF
Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646) MPX5999D 4 Sensors Freescale Semiconductor
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The Freescale MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table.
Part Number MPX5999D
Case Type 867
Pressure (P1) Side Identifier Stainless Steel Cap
MPX5999D Sensors Freescale Semiconductor 5
Pressure
PACKAGE DIMENSIONS
C R M B -AN
PIN 1 SEATING PLANE
1 2 3 4 5 6
POSITIVE PRESSURE (P1)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).
INCHES MILLIMETERS MAX MIN MAX MIN 16.00 0.595 0.630 15.11 13.56 0.514 0.534 13.06 5.59 0.200 0.220 5.08 0.84 0.027 0.033 0.68 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 18.42 0.695 0.725 17.65 30 NOM 30 NOM 12.57 0.475 0.495 12.07 11.43 0.430 0.450 10.92 0.090 0.105 2.29 2.66
L
-TG F D 6 PL 0.136 (0.005)
M
J S
TA
M
DIM A B C D F G J L M N R S OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN
STYLE 1: PIN 1. 2. 3. 4. 5. 6.
VOUT GROUND VCC V1 V2 VEX
STYLE 2: PIN 1. 2. 3. 4. 5. 6.
OPEN GROUND -VOUT VSUPPLY +VOUT OPEN
STYLE 3: PIN 1. 2. 3. 4. 5. 6.
CASE 867-08 ISSUE N BASIC ELEMENT
MPX5999D 6 Sensors Freescale Semiconductor
How to Reach Us:
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Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2009. All rights reserved.
MPX5999D Rev. 6 9/2009

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